Intel to bring out the metal at 45 nanometers

Intel Corp. will change two materials used in the manufacturing of its chips in order to improve performance and reduce power leakage as its transistors shrink over the next four or five years, the company announced Wednesday. "When Intel rolls out its 45 nanometer process technology, scheduled for 2007, it will substitute a "high-k" material for the silicon dioxide gate dielectric currently used in making transistors for its processors."

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