Winbond partners with OmniVision on 1.3-megapixel image module
Handset customers of Winbond Electronics have entered design-in stage for 1.3-megapixel image modules. The modules, which combine an image controller chip and DRAM from Winbond and a CMOS sensor from OmniVision Technologies, may start mass production as early as year-end.
More here at DigiTimes .
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