VIA unveils 1GHz Nehemiah processor
VIA Technologies on January 22 added one more product line to its C3 processor portfolio. Based on the company's new-generation Nehemiah core, VIA's latest C3 processors are manufactured on the 0.13-micron process and available now in both the Socket 370 CPGA (ceramic pin grid array) and EPGA (enhanced ball grid array) packaged modes.
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