VIA previews "John" for Ultra-Mobile PCs

Wenchi Chen, president and CEO of VIA Technologies, on June 7 laid out the company’s strategy of continuing to push the limits on miniaturization of the PC platform based on its self-developed chip solutions. Meanwhile, Chen gave a preview of "John", the next advance in the VIA CoreFusion processor platform series that combines a VIA C7-M mobile processor core with VIA’s upcoming VX700 mobile chipset.

More here at DigiTimes.

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