TSMC Ships 0.13-Micron chips to VIA

VIA Technologies Inc. has taken delivery of its first 0.13-micron wafers from Taiwan Semiconductor Manufacturing Co. The Taiwanese VIA has now joined Intel Corp. and Advanced Micro Devices Inc. in implementation of the 0.13-micron technology. The new VIA Cyrix microprocessors are designed for "value" PCs, notebook computers and information appliances.

VIA president and CEO Wenchi Chen says, "Through our close partnership [with TSMC], Via will be the first company in the world to launch a CPU using an advanced 0.13 micron process onto the market."

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