TSMC said to be adding flip-chip packaging capacity
07:08 - Monday 16 September 2002 by THG Reporting Team
Source: Tom's Hardware – Keywords: tsmc, said, to, be, adding, flip Category : Miscellaneous
Source: Tom's Hardware – Keywords: tsmc, said, to, be, adding, flip Category : Miscellaneous
Taiwan Semiconductor Manufacturing Company (TSMC) has recently begun a large-scale assessment of flip-chip (FC) packaging equipment and is planning to install FC packaging capacity in its Fab 7, according to reports from the packaging and testing market. The fab was formerly owned by Texas Instruments (TI).
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