TSMC to expand 65 nm and 90 nm capacity

Taiwan Semiconductor Manufacturing Company (TSMC) today held a meeting of its board of directors, which approved capital appropriation of $1.133 billion to expand 65 and 90 nanometer process capacity in 300 mm wafer fabs, according to a company filing with the Taiwan Stock Exchange (TSE). The board of directors at TSMC also approved capital appropriation of $9.2 million to expand 1.0 micron high voltage process capacity in Fab 2, Lora Ho, spokesperson and vice president said in the filing.

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