TSMC, UMC stay on FSG for low-k, 90-nm process

11:27 - Monday 24 November 2003 by THG Reporting Team
Source: Tom's Hardware – Keywords: tsmc Category : Miscellaneous

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are expected to keep using fluorinated silicate glass (FSG), a low-k dielectric material, for their 90-nanometer (nm) production, according to sources.

More here at DigiTimes


Add to my Del.icio.us   Digg it!
Ad
Talkback
Google Ads
Ad
Ad