Toshiba squeezes more chips into standard package
Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in products such as cellular telephones and personal digital assistants (PDAs), the company said Wednesday
Read the entire story .
SuSE, IBM gain higher security certification
- Disposable DVDs denounced
- Bagle cools off
- Motorola Earnings Rise Nearly Threefold
- SCO Sues Novell Over Unix Copyrights
- AMD Q4 Revenue Nearly Doubles
- Napster makes digital music more convenient
- Crucial 2GB PC3200 for AMD processors
- Red Hat Offers Linux Protection Plan
- What Will the PC of the Future Look Like?
Standard interconnect approved for network gear
- Linux penguin waddles to GameCube
- Cisco expands metro Ethernet offering
- Nintendo Unveils Dual-Screen Portable Game Unit
- Colubris adds 11a/b/g products, intros WLAN management system
- Checkpoint focuses on the threat within...
- D-Link extends media player line
- SMC adds low-cost 8 port managed switch with fiber uplink
- More song swappers sued
- NEC to Use USB On-The-Go in Phones
Sponsored
See more
Latest news
Miscellaneous Previous news
Partners
