Taiyo Yuden just let us know about what it claims is the world's smallest RF module for Bluetooth-based wireless communications devices, including cell phones and PDAs. The module uses a LTCC (Low Temperature Co-fired Ceramics) substrate that is achieved by embedding the filter, inductors and capacitor into the substrate and using flip-chip assembly techniques to mount the semiconductor. Measuring only 7.0mm (0.276") L x 7.0mm (0.276") W x 1.8mm (0.071") H, the module incorporates a Silicon Wave RF chipset that provides a Bluetooth 1.1-compliant Class 2 (max 4dBm) output. The gadget is designed to operate with various clock frequencies, allowing the designer to use an existing application frequency, rather than change to suit the module. Production samples will be available in February 2002, with volume production beginning in June.