Springdale changes will put pressure on SiS, VIA and AMD

04:50 - Friday 22 November 2002 by THG Reporting Team
Source: Tom's Hardware – Keywords: springdale, changes, will, put, pressure, on, sis Category : Miscellaneous

Intel's latest specification changes in its Springdale chipset are expected to affect not only Taiwanese chipset designers' product planning but also the new K8-core platform from Advanced Micro Devices (AMD).

More here at DigiTimes


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