Sources claim Samsung to establish BGA substrate plant in Suzhou
Samsung Electro-Mechanics will start volume shipping ball-grid array (BGA) substrate from a plant in Suzhou starting in mid 2006 for packaging Samsung DDR2 memory, according to industry sources. Local BGA substrate makers are not concerned about Samsung’s supposed move, claiming the potential impact would be limited.
More here at DigiTimes .
EMC re-invents itself: Q&A with EMC director Ricky Chung
- Alpine announces new GPS/DVD/TV solutions
- Samsung announces 40" OLED TV
- Eidos' board resigns as SCi's acquisition is completed
- Loosen the reins, says Google CEO
- ATI MVP mobos to be priced below SLI boards
- Doom coming to cellphones
- Dell preparing to attack broader new markets
- FTC wants to tweak CAN-SPAM Act
- Microsoft: Search is much more than you think
44 bugs: Netscape issues immediate security update for 8.0
- Private spacecraft builder gives US tips
- Microsoft warns of TCP/IP flaw
- Identity of file sharers protected in Canada ruling
- Hilton hackers revealed?
- Apple recalls notebook batteries - again
- Google hints at future products
- Details of ATI's Xbox 360 GPU unveiled
- Nvidia G70 is a 90 nm chip
- Room for one more: Gigabyte to offer third dual-GPU graphics card
Sponsored
See more
Latest news
Miscellaneous Previous news
Partners
