Samsung Electronics Develops Small-Footprint Package
Samsung today announced the development of a 1-gigabit (Gb) Double Data Rate (DDR) SDRAM die-stack Chip Scale Package (CSP) that offers two-512Mb DDR SDRAM dies in a single package. "The new package solution doubles memory density and at the same time, resolves the design constraints of mobile applications and high-performance servers that require higher memory capacity in a small footprint."
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