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• TI delivers WLAN development kit for stationary devices
  Monday 27 February 2006 – 04:00
  Texas Instruments (TI) has announced its CE WLAN developer kit (CE WLAN DK) 1.0 for stationary devices such as IP set top boxes, digital media adapters and personal video recorders.
• Infineon introduces silicon-based low noise amplifiers for UMTS/HSxPA and WLAN applications
  Tuesday 13 February 2007 – 05:09
  Infineon Technologies has released commercial silicon-based low noise amplifier (LNA) products that the company said offer a better performance-price ratio compared to Gallium Arsenide (GaAs) alternatives while also helping mobile phone suppliers to comply to 3GPP regulations.
• WLAN the dominant remote connectivity choice for mobile US professionals
  Thursday 12 October 2006 – 04:52
  The latest survey from Strategy Analytics has confirmed that the dial-up connection is well on its way to obsolescence as a remote access mode for roving US workers.
• Atheros certain to become top provider for WLAN solutions in 2006
  Thursday 16 February 2006 – 04:16
  Atheros Communications is likely to become the world's top maker of WLAN chips in 2006 since the company is leading rivals in introducing wireless LAN solutions compliant with the draft 802.11n specification, company president and CEO Craig Barratt said recently.
• Infineon on WLAN, the DRAM market and a design center in Taiwan
  Friday 13 June 2003 – 02:48
  Infineon Technologies plans to set up a design center in Taiwan to better serve its clients in the non-memory devices market, said Frank Chi, the company's Taiwan regional sales vice president, in an interview with DigiTimes.
• Broadcom: Global WLAN market unaffected by low season in 2006
  Tuesday 13 June 2006 – 04:03
  Global sales of WLAN devices were unaffected by the traditional low season in the first half of 2006, with this year's peak season to come in the second half as expected, said Michael Hurlston, vice president and general manager of the home and wireless business unit at Broadcom, in Taipei recently.
• Marvell announces first WLAN/Bluetooth chip for portable devices
  Thursday 17 August 2006 – 08:28
  Marvell today said that it has developed the words first chip that combines WLAN and Bluetooth functionality in one die.
• Intel marching into WLAN market, rumored to plan new RF module specification
  Thursday 23 May 2002 – 06:45
  Intel has made quick strides in the communications chip industry.
• Taiwan WLAN makers expect to take 25-30% of global market this year
  Monday 26 April 2004 – 05:09
  Sources at WLAN product makers in Taiwan indicated that Taiwan-based WLAN IC design firms expect to contribute 25-30% toward the total global market this year, up from 10% last year.
• Intel Looking To Place WLAN Mini-PCI Order In Taiwan
  Tuesday 27 August 2002 – 02:59
  Intel is said to be seeking Taiwanese manufacturers to supply mini-PCI modules for use in notebook PCs, a move expected to spark fierce competition among local network gear makers.
• Intel gives WLAN module order to Asustek, sources say
  Tuesday 1 April 2003 – 01:33
  Asustek Computer will supply Intel's WLAN mini-PCI modules for Centrino-based notebooks at several hundreds of thousands units a month, according to sources.
• Taiwan WLAN industry prepare for 802.11n
  Monday 19 July 2004 – 05:11
  Taiwan WLAN makers CyberTAN Technology and Global Sun Technology will soon start initial development of products based on the new WLAN standard, 802.11n, which the international standards group IEEE is slated to finalize in 2006.
• WLAN chip makers feeling pressure of price-cuts
  Thursday 29 August 2002 – 06:23
  As more and more chip design houses scrambled to launch their own wireless LAN chips, IC designers inevitably face price-cutting pressure in order to compete with one another, said a Taiwan WLAN solution provider.
• VIA to send out WLAN chip samples by year-end
  Monday 5 August 2002 – 04:54
  Given the company's development experience in the PC sector, VIA Technologies plans to introduce WLAN (wireless local area network)-use products before other communications chips, said Lin Tzu-mu, VIA's senior vice president for R&D engineering.
• WLAN Hotspots warm up
  Thursday 20 June 2002 – 01:58
  Two WLAN hotspot surveys are out (or rather publicised for the first time).