Northbridge migration from PBGA to FC packages on hold until cost drops. pbga fc packaging. The migration from plastic ball-grid array (PBGA) to flip-chip (FC) packaging for northbridge chips will not proceed much further this year, as VIA Technologies, ATI Technologies and Nvidia will continue using PBGA packaging for their solutions, according to industry sources.. The migration from plastic ball-grid array (PBGA) to flip-chip (FC) packaging for northbridge chips will not proceed much further this year, as VIA Technologies, ATI Technologies and Nvidia will continue using PBGA packaging for their solutions, according to industry sources. Sources at VIA indicated that the company has decided to continue using PBGA-packaged northbridge chips this year, as the price difference between FC and PBGA packaging remains significant....

Honda Fuel Cell Hydrogen FC. For a relatively conservative car company, Honda surprised nearly everyone with its latest fuel cell-powered sports car concept. Unveiled at the 2008 Los Angeles Auto Show, the Honda FC Sport is a design study model showcasing Honda’s hydrogen fuel cell technology in a high-performance package. Besides plain physics, the FC Sport also features a desirable driving position in the middle of the windshield with two passengers set back and at the driver’s either side – a layout commonly associated with the McLaren F1. Honda has traditionally shown off concept vehicles that are very close to the final production models, and we can only hope that the FC Sport, whenever it becomes a re......

Taiwan Semiconductor Manufacturing Company (TSMC) has recently begun a large-scale assessment of flip-chip (FC) packaging equipment and is planning to install FC packaging capacity in its Fab 7, according to reports from the packaging and testing market. Taiwan Semiconductor Manufacturing Company (TSMC) has recently begun a large-scale assessment of flip-chip (FC) packaging equipment and is planning to install FC packaging capacity in its Fab 7, according to reports from the packaging and testing market....

PCB maker Compeq Manufacturing lowered its profit targets for 2002, citing costs related to disrupted shipments of flip-chip (FC) substrates and the restructuring of its US plant and losses stemming from the appreciation of the NT dollar. PCB maker Compeq Manufacturing lowered its profit targets for 2002, citing costs related to disrupted shipments of flip-chip (FC) substrates and the restructuring of its US plant and losses stemming from the appreciation of the NT dollar....

Intel has reportedly been actively adding to its long list of Pentium 4 (P4) flip chip (FC) II IC substrate suppliers as part of a strategy to reduce costs and put up barriers to competition, say PCB and packaging and testing firms. Intel has reportedly been actively adding to its long list of Pentium 4 (P4) flip chip (FC) II IC substrate suppliers as part of a strategy to reduce costs and put up barriers to competition, say PCB and packaging and testing firms....

Taiwan Semiconductor Manufacturing Company (TSMC) deputy CEO FC Tseng and United Microelectronics Corporation (UMC) CEO John Hsuan said on August 23 that Taiwan's semiconductor industry needs to overcome a lack of IC design personnel and insufficient cooperation between the IC manufacturing and design realms in order to climb higher on the global ladder. Taiwan Semiconductor Manufacturing Company (TSMC) deputy CEO FC Tseng and United Microelectronics Corporation (UMC) CEO John Hsuan said on August 23 that Taiwan's semiconductor industry needs to overcome a lack of IC design personnel and insufficient cooperation between the IC manufacturing and design realms in order to climb higher on the global ladder....

Working with disk manufacturer Seagate, Hewlett Packard this week announced a new disk drive which possesses similar characteristics to SATA in terms of cost and performance, but uses the FC protocol. Working with disk manufacturer Seagate, Hewlett Packard this week announced a new disk drive which possesses similar characteristics to SATA in terms of cost and performance, but uses the FC protocol....

Rumors are again circulating that Intel plans to exit the entry-level chipset market amid tight supply of flip chip (FC) substrates, with chipset makers such as ATI Technologies, Silicon Integrated Systems (SiS), VIA Technologies to benefit from Intel's exit, according to market sources.. Rumors are again circulating that Intel plans to exit the entry-level chipset market amid tight supply of flip chip (FC) substrates, with chipset makers such as ATI Technologies, Silicon Integrated Systems (SiS), VIA Technologies to benefit from Intel’s exit, according to market sources....