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IDF 2003 Fall, San Jose: No Mo Copper for Wireless
- Articles & reviews
IDF 2003 Fall, San Jose: No Mo Copper for Wireless. idf 2003 fall. Intel' CTO Pat Gelsinger's wireless vision of the future has no room for copper. During the third day at IDF in a typically American indoor environment at the large hall of the San José Convention in which air conditioning blasted out cold air below 69 degrees Fahrenheit, Gelsinger described a future of wireless communication sans copper cable, which emphasized "safety" and "reach."...
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AMD samples copper Athlons
- News
Code-named Thunderbird, the upcoming Athlon chip with integrated Level 2 cache and copper interconnects is expected to ship by midyear. Because of its low resistivity compared to conventional aluminum, copper interconnects offer a major boost in performance in high-end microprocessors and, more recently, in field-programmable gate arrays....
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HP to ship first copper chip next year
- News
HP to ship first copper chip next year. hp to ship first copper chip next year. Hewlett-Packard will deliver its first chip to incorporate copper technology in the first half of next year, company officials said. Hewlett-Packard will deliver its first chip to incorporate copper technology in the first half of next year, company officials said....
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IBM to make copper Compaq chips
- News
IBM to make copper Compaq chips. ibm to make copper compaq chips. A Bloomberg.com writer says IBM will release details of an agreement to make copper versions of Compaq's Alpha processors next week. A Bloomberg.com writer says IBM will release details of an agreement to make copper versions of Compaq's Alpha processors next week. The IBM process involves the use of copper conducting wires, rather than the common and less efficient aluminum, and a layer of insulation underneath a chip's transistors, preventing performance-slowing electrical charge leaks into the silicon....
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Teradyne system tests copper for ADSL
- News
Teradyne system tests copper for ADSL. teradyne system tests copper for adsl. While demand for high-speed Internet connections is increasing, the cost of testing copper telephone lines for asymmetric digital subscriber line (ADSL) suitability is a significant barrier to deployment. While demand for high-speed Internet connections is increasing, the cost of testing copper telephone lines for asymmetric digital subscriber line (ADSL) suitability is a significant barrier to deployment. Teradyne Inc., however, has released a new version of its Celerity ADSL loop-qualification test system that can determine the suitability of a copper line for ADSL with or without removing the "bridged taps" and "load coils" that frequently prevent the use of older lines for broadband....
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Sun and TI Push Copper UltraSPARC III Processors For Systems Manufacturing
- News
Sun and TI Push Copper UltraSPARC III Processors For Systems Manufacturing. sun and ti push copper ultrasparc iii processors for systems manufacturing. Sun Microsystems and Texas Instruments told us yesterday that copper interconnect-based versions of the 900 MHz UltraSPARC III microprocessor have passed all internal qualifications tests and are planned for shipment in Sun Blade 1000 workstations within the next 90 days. Sun Microsystems and Texas Instruments told us yesterday that copper interconnect-based versions of the 900 MHz UltraSPARC III microprocessor have passed all internal qualifications tests and are planned for shipment in Sun Blade 1000 workstations within the next 90 days. Copper enables a clock speed increase while using the same power as the aluminum interconnect-based 750 MHz UltraSPARC III chip....
Relevancy : 84.98% -
600 MHz RM7000B Copper MIPS Processor
- News
600 MHz RM7000B Copper MIPS Processor. 600 mhz rm7000b copper mips processor....
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Inside Intel's Copper P3
- News
Inside Intel's Copper P3. inside intels copper p3. The company just put out a report about its investigation of the Intel Pentium III 0.13 micron all copper process technology. Intel has re-launched the processor this year after changing its architecture from the 0.18 micron manufacturing process to 0.13 micron technology using copper and the new version of the chip is said to consume up to 40% less power and be up to 20% faster than the 0.18 micron devices. Most of that information can be had from listening to Intel's marketing wonks, but Chipworks goes a little further by telling us that the processor is manufactured in a full CMP 0.13 micron process (0.07 micron gate lengths) with six levels of damascene copper and one level of polysilicon....
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UMC's 0.15-micron copper process used for SandCraft's SR71040A
- News
UMC's 0.15-micron copper process used for SandCraft's SR71040A. umc. On June 24, United Microelectronics Corporation (UMC) announced that it is manufacturing the new SR71040A CPU from US-based design house SandCraft on its 0.15-micron copper process. On June 24, United Microelectronics Corporation (UMC) announced that it is manufacturing the new SR71040A CPU from US-based design house SandCraft on its 0.15-micron copper process....
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PSC adopts Mitsubishi's copper technology and drops US$50 million on equipment to meet Japanese orders
- News
PSC adopts Mitsubishi's copper technology and drops US$50 million on equipment to meet Japanese orders. psc adopts mitsubishi. In anticipation of a larger volume of orders from Japanese IDMs (integrated device manufacturers), Taiwan-based Powerchip Semiconductor (PSC) has adopted Mitsubishi Electric's copper processing technology, while also purchasing an additional US$50 million worth of copper processing equipment, stated PSC spokesperson and vice president Eric Tang on July 8. In anticipation of a larger volume of orders from Japanese IDMs (integrated device manufacturers), Taiwan-based Powerchip Semiconductor (PSC) has adopted Mitsubishi Electric's copper processing technology, while also purchasing an additional US$50 million worth of copper processing equipment, stated PSC spokesperson and vice president Eric Tang on July 8....
Relevancy : 84.98%









