Rambus aims to offer PCIe Gen2 PHY solution on 65 nm with TSMC by mid-2007
Conducting its own developer forum in Hsinchu on October 25, Rambus is using the event to promote its physical-layer (PHY) interface solution supporting the upcoming PCIe 2.0 (Gen2) specification. According to Rambus, it aims to offer the solution with guidelines for the 65 nm process at Taiwan Semiconductor Manufacturing Company (TSMC) by the middle of next year.
More here at DigiTimes.
AMD's "Fusion" processor to merge CPU and GPU
- Vista, Office 2007 coupons worth a second look
- Falcon Northwest goes retail
- Microsoft to release second beta of XNA personal game development suite
- Microsoft releases final version of Windows Defender
- SGI goes after ATI with patent infringement suit
- World of Warcraft expansion to miss holiday season
- Lik-Sang sued out of existence by Sony
- Toys R Us opens up pre-orders for Wii this Sunday
- Blind web surfers sue Target for accessibility
HD RPTV sales surged 30% in August
- Sub-$500 AMD notebooks from Dell to hit the market in November
- Microsoft reportedly delays release of RTM version of Vista
- Fedora Core 6 makes its debut
- Google offers customizable search engines
- Thieves raid Apple employee store for third time
- No job cuts at ATI says AMD
- Novell ships real-time SMP x86 Linux
- Adobe's Digital Editions nears public beta
- Solar cells could power most of your home in the future
Sponsored
See more
Latest news
Miscellaneous Previous news
Partners
