Qualcomm and SMIC form strategic partnership
Qualcomm announced a strategic agreement with Semiconductor Manufacturing International Corporation (SMIC), whereby SMIC will provide integrated circuit (IC) manufacturing services to Qualcomm using a specialized BiCMOS process technology at its Tianjin, China facility.
This agreement will combine SMIC’s wafer fabrication capabilities and subcontractor infrastructure with Qualcomm’s leadership in 3G wireless technologies, with a focus on power management ICs.
More here at DigiTimes.
Kingston VP: DRAM prices to be stable through year-end
- Samsung claims to introduce highest-density MMC cards
- Second Hand Smoke: The Demise of Objective Benchmarking
- Pentium D prices fall due to Core 2 intro, some Athlon 64 X2 prices follow
- Intel aims to ship 1 million Core 2 Duo processor within seven weeks
- Dell XPS 700 upgrades to Core 2 Duo, Extreme on time, but will it ship?
- Kazaa settles with movie studios, music publishers, vows to go legit
- Up to $16,000: Core 2 Duo computers flood the Net
- Calling Microsoft 'multicore,' CEO Ballmer prepares analysts for Vista delay
- Intel is back: Core 2 Duo launches
Realtek wireless USB PHY transceiver ASP to halve by 2007
- Tight supply of 32" TV panels on the horizon
- HP claims over 70 licensees of Lightscribe
- Thermaltake introduces NAS-RAID drive storage system
- Intel resumes Celeron D 315/326 offerings for channel
- Nvidia to soon provide SLI support to Intel
- HP's new Core workstations highlight Opteron's need for more performance
- Linksys rolls out two SOHO VPN routers
- Paris Hilton, plastic surgeons and Playboy Playmates on Itunes
- Microsoft to bet "hundreds of millions of dollars" on Zune - report
Sponsored
See more
Latest news
Miscellaneous Previous news
Partners
