Philips told the world this week about its new solder mask defined (SMD) hybrid device for CATV-based broadband communications applications. The BGS67A high dynamic range amplifier module operates at a voltage supply of +12V in a leadless SOT567A package, and does its work as a 65MHz, 25-dB reverse amplifier for two-way CATV systems. It has a total current of 85 mA to reduce power dissipation and the bottom of its substrate incorporates AgPt metallization with a dimension of 14mm, which Philips says prevents substrate cracks caused by differences in the thermal coefficient between the substrate and the PCB on which the module is soldered. A solder mesh has also been applied for distribution of the solder layer and to prevent excessive solder flow, which can cause shorts between the ground and other connections. Other bells and whistles on the BGS67A include silicon nitride passivation and gold metallization. Samples mounted on a test board with pin connectors for testing on the standard SOT115 test fixture are now available and the BGS67A itself is available taped, on reel, or blister priced at $10 USD per unit in quantities of 1,000.