NEC just let us know about its new series of 20 to 48 megabit (Mb) low-power, stacked multichip package random access memory (S-MCP RAM) products for mobile applications like cellular phones, PDAs and other mobile terminals. The new S-MCP RAM lineup consists of combinations of 16 Mb and 32 Mb mobile-specified RAM for working memory and 8 Mb and 4 Mb low-power SRAM products for battery-backup memory. NEC says it developed the 32 Mb and 16 Mb mobile-specified RAM products to complement the 8 Mb and 4 Mb low-power SRAM products that can be used as battery backup in mobile applications. The new S-MCP series, using stacked multichip packaging technology, combines both the mobile-specified RAM and low-power SRAM in a high-density, low-power package. Combining two or three RAM and SRAM products within a single package provides 20 Mb to 48 Mb capacity while letting you use mobile-specific RAM and SRAM for your respective working memory and backup memory or choose to use the entire capacity as working memory. The low-power 8 Mb and 4 Mb SRAMs use full CMOS memory cells to achieve a low standby dissipation of 13 microamps (uA) for the 8 Mb device and 7 uA for the 4Mb device at 3.0V. Likewise, the 32 Mb and 16 Mb mobile-specified RAM have a low standby dissipation of 100 uA and only 10 uA in "power down'" mode. Volume production for the first 16 Mb RAM/4 Mb SRAM package, the MC-2311100, is scheduled to begin this month. The sample price for the MC-2311100 is $18 with a total initial production level for the four combinations planned at one million units per month.