NEC ramps up GameCube's Flipper production
The EETimes reports that NEC Corp. is in volume production of the system-on-a-chip device for Nintendo Co. Ltd.'s next-generation GameCube gaming console. The GameCube is scheduled for a July launch in Japan and October in the US. NEC's new fab on Kyushu boasts a 8,300-square-meter clean room and can produce ten-thousand 8" wafers a month. Sony Computer Entertainment Inc.'s inability to produce the chips it needed to launch the PlayStation 2 properly has reportedly helped Nintendo decide to go to an experienced chip maker for its key silicon.
Read the source article at eetimes.com.
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