Infineon Technologies is teaming up with chipmaker United Microelectronics Corporation (UMC) and handset makers, including BenQ, to promote its second generation platform for ultra-low-cost (ULC) handsets, Hermann Eul, member of the board and head of the Communication Solutions business group of Infineon, said on the sidelines of the 3GSM World Congress that is running February 13-16 in Barcelona, Spain. Infineon announced last week sample availability of its new handset platform, the ULC 2, as well as a baseband processor for multimedia mobile phones of the so-called 3.5-generation, prior to the opening of the congress.

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