Bigger isn't always better. In certain applications, like dense rack-mount servers and other compact platforms with space and thermal limitations, shrinking components is an absolute necessity. Kingston, in particular, wants to give you the ability to squeeze more RAM into such systems and is now shipping 1" high 128MB and 256MB PC100 and PC133 low-profile SO-DIMM modules using Chip Scale Packaging (CSP) technology. CSP is a packaging scheme that results in smaller memory chips and allows for tighter placement of memory chips on modules. Kingston says its SO-DIMM height allows for better airflow and more efficient cooling in future compact server applications, so that PC OEMs, system integrators, and IS departments can reduce the cooling requirements for compact platforms such as 1u/2u rack-mounted servers. In addition to shipping these modules to its channel and end-user customers, Kingston is shipping samples to PC OEMs and networking and communications product manufacturers for qualification on upcoming platforms. Kingston also has a line of low-profile modules using conventional TSOP (Thin Small Outline Package) packaging. Pricing for the ValueRAM 1.0 inch Low-Profile DIMMs is $36.00 for a 1.0" 128MB PC100 SO-DIMM, $149.00 for a 1.0" 256MB PC100 SO-DIMM, $36.00 for a 1.0" 128MB PC133 SO-DIMM, and $79.00 for a 1.0" 256MB PC133 SO-DIMM.