Intersil and VoicePump Work to Push VoP Development

Intersil just let us know that it will combine its subscriber line interface circuits (SLICs) with DSPs from VoicePump Inc. (a subsidiary of DSP Group Inc.) to create a new four-channel, voice-over-packet (VoP) development platform and reference design. The reference design will combine the four Intersil micro-lead-frame (MLF) HC55185 ringing SLICs with VoicePump's programmable four-channel VP140 mixed-signal DSP. The VP140 is a member of VoicePump's VP100 family and is designed to integrate DSP Group's TeakLite DSP core with most of the circuitry needed to accommodate four packet-voice channels in a single processor. The two companies think their joint development platform will provide customers with a complete turnkey solution that shortens time-to-market and reduces engineering/design costs for the VoP Integrated Access Devices (IADs) identified with voice over digital subscriber line (VoDSL), voice over Internet protocol (VoIP), or voice over broadband (VoB). The 7 X 7 mm MLF HC55185 Ringing SLIC includes onboard ring generation, programmable transient current limiting, integrated MTU DC characteristics, silent polarity reversal, pulse metering, on-hook transmission, tip-open ground-start operation, balanced and unbalanced ringing, thermal shutdown with alarm indicator and a low parts count. VoicePump's VP100 series integrates DSP Group's TeakLite programmable DSP core with program/data memory, a host processor interface, analog front end, analog-to-digital converters, and digital-to-analog converters. The VP100 family can also integrate the necessary DSP firmware to perform voiceband processing functions, including speech compression and decompression, echo cancellation and associated telephony signaling functions.