Specification Overview

07:00 - Saturday 19 June 2004 by Patrick Schmid
Source: Tom's Hardware – Keywords: intel, stakes, its, vision, of, the, pc, future, with, 775, launch

Table of content:
13 – Specification Overview
  1. 1 – Intel's 775 Launch Mixes Ambition With A Strong Aftertaste
  2. 2 – First Contact
  3. 3 – Obstacles And Hurdles
  4. 4 – More Findings
  5. 5 – New Socket: LGA 775
  6. 6 – LGA 775 Processor Installation
  7. 7 – LGA 775 Processor Installation, Continued
  8. 8 – LGA 775 Processor Installation, Continued
  9. 9 – MSI's CPU Installation Tool
  10. 10 – Transitional Products
  11. 11 – Poor Thing: Intel Reference Cooler
  12. 12 – New Processors: P4 Prescott Up To 3.6 GHz
  13. 13 – Specification Overview
  14. 14 – Model And Pricing Information
  15. 15 – Processor Overview:
  16. 16 – New Chipsets: 925X, 915G, 915P, 915GV
  17. 17 – New Chipsets: 925X, 915G, 915P, 915GV, Continued
  18. 18 – 925X Express Chipset
  19. 19 – 915G Express Chipset
  20. 20 – 915G Express Chipset, Continued
  21. 21 – 915G Express Chipset, Continued
  22. 22 – 915P Express Chipset
  23. 23 – Chipset Devices
  24. 24 – Intel Puts The Lock On Overclocking
  25. 25 – How To Unlock The Overclocking Lock
  26. 26 – New Memory: DDR2-533, Continued
  27. 27 – DDR2 Memory Vendors
  28. 28 – Intel Flex Memory Technology
  29. 29 – New Interlink: PCI Express
  30. 30 – More SATA, More RAID, More Ports
  31. 31 – Matrix RAID
  32. 32 – Creating A RAID Array
  33. 33 – More HD Performance For Free: Command Queuing
  34. 34 – More Networking: Intel Wireless Connect Technology
  35. 35 – New Audio: High Definition Audio
  36. 36 – Asus P5AD2 Premium
  37. 37 – Foxconn 925A01
  38. 38 – Test Setup
  39. 39 – Benchmarks And Settings
  40. 40 – Platform Benchmarks
  41. 41 – DirectX 8 Benchmarks
  42. 42 – DirectX 8 Benchmarks, Continued
  43. 43 – DirectX 9 Benchmarks, Continued
  44. 44 – Video Benchmarks
  45. 45 – Video Benchmarks, Continued
  46. 46 – Application Benchmarks
  47. 47 – Application Benchmarks, Continued
  48. 48 – Synthetic Benchmarks
  49. 49 – Synthetic Benchmarks, Continued
  50. 50 – Processor Power Consumption
  51. 51 – Integrated Graphics Benchmarks
  52. 52 – Game Benchmarks
  53. 53 – Halo
  54. 54 – Far Cry
  55. 55 – Video Performance
  56. 56 – Networking Benchmarks
  57. 57 – Storage Subsystem Benchmarks
  58. 58 – Conclusion
  59. 59 – A Final Note

Specification Overview

Ad

The heat spreader is an essential element of Intel's processors that both ensures heat dissipation and die protection.

The new top model will be the Pentium 4 Processor 560, which runs at 3.6 GHz. Four other versions, with model names 550 to 520, run at 3.4, 3.2, 3.0 and 2.8 GHz. While the TDP was 103 °C for the socket 478 Pentium 4 Prescott at 3.4 GHz, the maximum power output now will be 115 W. As a result, there's not much overclocking margin with the top models. More than ever, you should keep a close eye on the thermal parameters if you plan to go for a LGA 775 machine.

Processor Frequency Thermal Design Power (TDP) Tcase VID
Pentium 4 520 2.8 GHz 84 W 5 - 67.7 °C 1.25 - 1.40 V
Pentium 4 530 3.0 GHz 84 W 5 - 67.7 °C 1.25 - 1.40 V
Pentium 4 540 3.2 GHz 84 W 5 - 67.7 °C 1.25 - 1.40 V
Pentium 4 550 3.4 GHz 115 W 5 - 72.8 °C 1.25 - 1.40 V
Pentium 4 560 3.6 GHz 115 W 5 - 72.8 °C 1.25 - 1.40 V

Intel recently inaugurated their Fab 24 in Leixlip, Ireland, which is the fourth facility to produce chips on 300 mm wafers. However, the majority of processors shipped these days is still based on the 130 nm Northwood core.


Talkback
Be the first to comment on this review!

Note You are going to post a comment as anonymous.



  •
Submit my comment
Google Ads