Infineon to Partner with AMD and UMC
Infineon Technologies of Germany has announced that it will enter into a development program on 65/45 nanometer manufacturing platform technologies with U.S.-based Advanced Micro Devices, Inc. (AMD) and United Microelectronic Corporation (UMC) of Taiwan to produce new microelements for next generation chips.
AT&T Wireless and Microsoft Announce Wireless Merger
- I.B.M. to Purchase PricewaterhouseCoopers Consulting
- ATI to introduce Radeon 9500 in mid 3Q
- Wistron lands 1.1 million PDA contract from Dell, due out for Christmas
- ATI denies rumor of OEM orders that compete with production partners
- Leadtek to start network IP camera shipments to NTT-ME in August
- ALi expects rising DVD player and USB 2.0 chip shipments in 2H
- Lite-On IT gaining ground in South Korea optical drive market
- Toshiba launches 60GB, 2.5" hard drive with world's fastest rotation speed
- AMD, Fujitsu and Saifun to jointly develop flash technology
Retail Computer Software Sales Gain Strength
- Batman: Vengeance To Be Released For PC
- New Doom III Screen Shots Released
- Interview: Trend forecasts in China's semiconductor industry
- Toppoly pushes notebook panel shipments to October
- Compal Electronics: Handset component supply to recover in 2Q 2003
- Compal and Ares receive new Panasonic handset orders
- Mobos: August buying sentiment likely weakened by Intel's September price cuts
- VIA extending to USB 2.0 peripheral controller chip market in 3Q
- SiS's RDRAM-based R658 chipset to hit the market in 3Q
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