IDF 2003 Fall, San Jose: No Mo Copper for Wireless
Table of contents
- 1. Copper No Mo
- 2. Copper No Mo, Continued
- 3. DDR2 - Time Schedule To 2006
- 4. BTX - New Form Factor For Flexible Design
- 5. ATI
- 6. ALi
- 7. Dell, HP, Sony: Pocket PCs
- 8. Rambus Rocks On
Intel' CTO Pat Gelsinger's wireless vision of the future has no room for copper. During the third day at IDF in a typically American indoor environment at the large hall of the San José Convention in which air conditioning blasted out cold air below 69 degrees Fahrenheit, Gelsinger described a future of wireless communication sans copper cable, which emphasized "safety" and "reach." The theme of tomorrow's world where PCs and laptops will routinely have Intel inside wireless antennas: Radio Free Intel.
The "Digital home" was the focus of the first day.
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