Armonk (NY) - IBM has patented a self-assembly technology for chip manufacturing that uses the same kind of pattern-creating process that forms seashells and snowflakes.

The new process creates trillions of insulating holes found in computer chips, and according to IBM allows electrical flow at a speed 35% faster than in chips made from conventional methods.

IBM says this also reduces energy consumption by 15%. It's because of vacuums that are created from the holing process, reducing the amount of heat and thus allowing faster movement of electrical signals.

The process of creating micro-sized holes has been a challenge, though, and conventional techniques have not been able to reach the level of detail that the new method can, says IBM.

Currently, the self-assembly process is being used on a very limited basis, but IBM says it will be integrated fully into its manufacturing lines by 2009.