IBM announces 0.13 micron breakthrough
IBM Corp. has announced a new CMOS 9S technology using copper wiring, silicon-on-insulator transistors and improved low-k dielectric insulation to build 0.13 micron technology chips. Prototypes are in production with the first shipments to customers scheduled for early 2001. IBM says that the technology will eventually yield low-cost 10GHz chips.
For more information, read siliconstrategies.com and theregister.co.uk.
Sponsored
See more
Latest news
Miscellaneous Previous news
Partners
