IBM Corp., Sony Corp, and Toshiba Corp. are cooperating in a $400 million research and development effort aimed at producing a 0.10-micron feature-size chip code-named Cell by 2004. The group will also use IBM's copper interconnect layers and silicon-on-insulator technology, and will integrate many functions onto the single system-on-a-chip processor. Sony's PlayStation III game console is set to use one of the effort's processors.
In related news, Sony and Toshiba are moving the PlayStation 2's Emotion Engine CPU and Graphics Synthesiser chip to the 0.13 micron fabrication process. The transition will help the PS2 to compete with Microsoft's Xbox.