Height-Challenged High Density DDR333 FBGA Memory Modules

Reducing the size of RAM modules and other components plays a big part in the introduction of those skinny little "blade" server racks. The less space the things take up, the better, and they're most likely designed to put you IT folks in much smaller rooms. However, you'll get no sympathy from those who spend their working lives in veal-fattening pens (cubicles). As work spaces and equipment get smaller, one wonders whether being below average in height could eventually become a saleable job qualification ("You must be under four feet tall because our pens are really small"). Reducing the hardware footprint is probably a good thing, and Kentron Technologies is now producing a new line of high-density, DDR memory modules based on the FBGA (Fine-pitch Ball Grid Array) DDR packaged devices, to squeeze more power into less space. FBGA is the new JEDEC-standard memory packaging solution required for higher speed memory devices. These new packages move the device connections from metal leads along the side of the device (existing TSOP devices) to ball connections on the underside of the device. This allows for connections with shorter line lengths from the actual packaged semiconductor die. Kentron has expanded its FEMMA family of memory modules to include the new PC2700, FBGA DDR333 memory devices. Densities will range from 512MB (using 128MB chips), 1GB (using 256MB chips) and 2GB (using 512MB chips). The new line of modules will have the low-profile height of 1.125"es required by the new very thin ("Hyperdense", "1U," and "Blade") server and telecom solutions. Kentron says that mproved heat dissipation is a key advantage of the new FBGA FEMMA modules. The PC2700 1.125" high, FEMMA FBGA memory modules will be available for sampling in Q4, 2001.