Fujitsu invents fast-curing lead-free solder alternative

Fujitsu Laboratories has produced a lead-free, conductive adhesive that can be cured in only three seconds - which should lower chip fab costs. Alternate adhesives take four times as long to set. The technology is of interest to chipmakers looking for a lead-free, cheaper alternative to conventional soldering. Conductivity is accomplished through the uniform dispersion of micro-capsule fillers made of silver particles coated with an insulating epoxy resin. Though the process has passed initial test, another six months of long-term test will be performed before it moves to large-scale manufacturing.

Read the source article at eetimes.com.