Extreme-ultraviolet vs. electron-beam-projection update
The rivalry between advocates of extreme-ultraviolet and electron-beam-projection lithography continues with new developments last week at the Society of Photometric and Instrumentation Engineers (SPIE) Microlithography conference. Advocates of Extreme-ultraviolet as the next generation chip etching technology, led by Intel Corp. won an important defector from the other side - Motorola Inc. The IBM-Nikon e-beam projection lithography team, however, claims important technological breakthroughs and the integration of an IBM-developed Prevail e-beam optical system into Nikon's scanner column hardware in Japan.
For more information, read eetimes.com.
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