Epson builds first ultra-thin multilayer circuit board

Seiko Epson Corporation today announced that it has succeeded in leveraging its proprietary inkjet technology to develop what the company believes is the world’s first 20-layer circuit board.

Multilayer circuit boards are normally produced by using a photolithography process to pattern a copper foil bonded to a base board. However, the industry has struggled to produce thin, lightweight, high-density multilayer circuit boards cheaply because the traditional process requires thick copper layers ; the creation of a different photomask for each layer ; a complex step for forming through-holes to electrically connect different layers ; and a large volume of photoresist, developer, etchants, stripping agents and other chemicals.

Read the complete story Tom’s Hardware Guide . (PhysOrg.com)