DDR demand keeping TSOP packaging utilization high
Despite a dip in flash memory demand, a burst in DDR demand has kept utilization rates for their complementary tiny small outline packaging (TSOP) as high this quarter as last quarter, with some companies even reaching full capacity, report memory chip suppliers.
More here at DigiTimes
Foxconn appoints former Motorola executive to head its handset R&D unit
- Taiwan handset shipments show growth in 2Q
- Sampo to use SmartASIC LCD TV controller ICs
- Hitachi opens Mobara V3 TFT LCD factory
- Taiwan display panel TFT LCD production, revenues slip in June
- 256Mbit DDR: Spot price leap drives late July contract prices up 26%
- July clone mobo orders mostly short-term
- Graphics card makers maintain conservative outlook for July sales
- Gray-market chipset prices appear weak due to unclear market demand
- Taiwan MLCC makers go mainstream and give up niche production
IEK: Taiwan first-half IC production rose nearly 10% YoY
- Japanese MLCC firms may outsource low-end production
- NTT DoCoMo to establish i-mode consulting firm in the Netherlands
- Media Reality Technologies expects LCD controller IC shipments to continue strong growth
- Integrated LCD controller IC prices reportedly falling
- Taiwan IC design firms accept new challenge: To provide system design for China customers
- DRAM makers pushing SDRAM with DDR sales
- Nvidia experiencing rising demand, expects notebook sector share to reach 40% in 2002
- Mobos: VIA should feel little impact from nForce2
- Goldman: First-tier mobos to enjoy 25% growth in 3Q shipments
Sponsored
See more
Latest news
Miscellaneous Previous news
Partners
