IDF Taiwan: Intel confirms packages for Conroe and Woodcrest, but remains fuzzy on Merom
At IDF Taiwan, Intel officially confirmed packaging for two of its first 65nm dual-core processors (Conroe and Woodcrest) based on the next-generation Intel Core microarchitecture, but failed to clarify packaging on a third processor (Merom) using Intel Core.
According to Dan Casaletto, vice president of Intel’s digital enterprise group and director of microprocessor architecture and planning, the desktop Conroe processor will utilize the LGA 775 package, which has been in use since 2004 when it was introduced for the Pentium 4 platform.
More here at DigiTimes.
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