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Alle Benchmarks Thermal Compound Charts

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We looked at various heat sinks and thermal compounds. A proper application of compound to a decent cooling solution is far more important than going for a compound that appears better by numbers - and not paying enough attention to its application. As a result we decided to come up with as many as four testing scenarios instead of only one, so we can do justice to everyday life. The most important criteria are contact pressure, the coolant (air or a liquid) and direct contact way (on-die) versus going through a heat spreader. Our first test scenario uses Corsair's H80i compact liquid cooler with constant fan speed and AMD's FX 8350 CPU at 4.2 GHz. Then we use be quiet!'s ShadowRock top flow cooler, which applies quite some pressure to the Intel Core 2 Quad Q6600 at 2.66 GHz. The third system is based on Intel's boxed cooler with push pins and a Core 2 Duo Q6850. Lastly, we also test compounds on a Radeon HD 4850 graphics card without any heat spreader with a Zalman cooling device, as long as the thermal compound is suitable for this application option. The results represent an everyge of ann four test scenarios, which we executed for 60 minutes using LinX and after an initial 4-hour burn in. For all processors we show Delta-T (ΔT), which in our case represents the difference between Tcase (head spreader) and the usually constant environment temperature of 22°C (72°F). The GPU results are based on the core temperature of our test graphics card after a 4-hour burin in with MSI's Kombustor at a similar environment temparature.

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