ST Microelectronics and IBM collaborate on 32 nm, 22 nm technology
ST Microelectronics and IBM announced an agreement to jointly work towards a “recipe” that is used to develop and manufacture 32 nm and 22 nm complementary metal-oxide-semiconductors (CMOS) on 300 mm wafers.
As part of the agreement, each company will establish a technical development team at the other company’s facility. For bulk CMOS development, ST said it will send a research and development team to IBM’s Semiconductor Research and Development Center in East Fishkill and Albany, New York. At the same time, IBM will provide a research and development team at ST’s 300mm wafer semiconductor R&D and fabrication facility in Crolles, France.
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ST and IBM said product resulting from this agreement will find use in consumer and server markets as well as in wireless applications, such as cellphones and global positioning devices.
Financial details about this agreement were not disclosed.
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- Microelectronics ,
- IBM
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